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(CityRegions.Com, August 29, 2018 ) Electronic devices are available in a variety of package types and include semiconductors (integrated circuits), magnets, capacitors, and resistors.
The semiconductor packaging services market has drawn the greatest attention in the investment community.
The Semiconductor packaging industry is expected to achieve a CAGR of 10% over the next three to five years. This trend is not only driven by the increasing market demand for packaging of components for various new semiconductor applications in the fields of radio, Internet and consumer products, but also external packaging assembly by semiconductor device manufacturers (SDM). Driven by the growth of test runs.
Over the next five years, Publisher projects that Advanced Semiconductor Packaging will register a 13.2% CAGR in terms of revenue, reach US$ 46600 million by 2023, from US$ 22200 million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Semiconductor Packaging market by product type, application, key manufacturers and key regions.
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To calculate the market size, Publisher considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
Segmentation by application:
Aerospace and Defense
Other End Users
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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global Advanced Semiconductor Packaging by Players
4 Advanced Semiconductor Packaging by Regions
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